Kemapoxy 131
Kemapoxy 131
Kemapoxy 131 is a dual-component, 100% solvent-free liquid epoxy compound characterized by its ultra-low viscosity.
Technical Property | Value / Description | Engineering Benefit |
Composition | Epoxy Resin + Hardener (A+B) | Chemical cure ensures total solidification |
Viscosity | Very Low (Liquid) | Maximum penetration & seamless air release |
Dielectric Strength | $25-30$ KV/mm | High-voltage protection and reliability |
Pot Life | $30 - 45$ Mins (at $25$°C) | Sufficient time for intricate potting tasks |
Solid Content | 100% | Zero shrinkage for dimensional stability |
kemapoxy 115
Absolute Electrical Insulation: High dielectric barrier protects sensitive electronic components.
Deep Penetration: Low viscosity allows the resin to flow into the tightest gaps and coils.
Harsh Environment Shield: Protects electrical joints from chemical corrosion, salts, and humidity.
Mechanical Stability: Provides a rigid protective shell against vibrations and physical impact.
Potting and encapsulation of electrical cable joints.
Insulating electrical motor windings and small transformers.
Encapsulating Printed Circuit Boards (PCBs) for environmental protection.
Filling micro-gaps in mechanical parts requiring rigid insulation.
Preparation: Ensure all molds or junction boxes are dry and free from dust or grease.
Mixing: Add Component B to Component A and mix thoroughly at a slow speed to prevent air entrapment.
Casting: Pour the mixture slowly into one side of the mold to allow air to displace naturally.
Curing: Allow to set completely (typically $24$ hours) before energizing the circuit.
